ÇмúÇà»ç¾È³»

¾Ë¸²¸¶´ç ÇмúÇà»ç¾È³»
All For System; R&D Plasma, Vacuum, ±âŸ Àåºñ Á¦ÀÛ ¹× Ãë±Þ
ÀÛ¼ºÀÚ
AFS
ÀÛ¼ºÀÏ
2009-11-11
Á¶È¸
1775
All For SystemÀº RF ¹× Plasma ¿øõ ±â¼úÀ» °¡Áø ¾÷ü¿¡¼­RF Module°ú Plasma SystemÀ» ¼³°è ¹× Á¦ÀÛ ÇßÀ» »Ó¸¸ ¾Æ´Ï¶ó °³¹ß¿¡µµ Âü¿©ÇÑ ¿£Áö´Ï¾î°¡ ¼³¸³ÇÑ È¸»çÀÔ´Ï´Ù.
Vacuum(Áø°ø) ¶Ç´Â Plasma(ÇöóÁ) System ¹× ½ÇÇè¿ë ÀåºñµéÀ» °í°´ÀÌ ¿øÇÏ´Â
ConceptÀ» ÃÖ´ëÇÑ ¹Ý¿µÇÏ¿© Á¦ÀÛ °¡´ÉÇÑ ±â¾÷ÀÔ´Ï´Ù.

Á¦ÀÛÇÏ´Â Item:
1. Plasma System
1) Á¦Ç°±º
- Deposition (Coating): PECVD, RF/DC Sputter
- Etcher
- Asher
- Plasma Surface Treatment System
- Plasma Polymerization System
- ÃʼҼö¼º ó¸® Àåºñ
=> Gas ¹× Plasma¸¦ Àû¿ëÇÏÁö ¾Ê´Â Vacuum Àåºñ
- ´Ù±â´É Plasma ó¸® Àåºñ
=> PE(CCP) & RIE(CCP) & Plasma Polymerization System
=> Surface Treatment, PR Ashing(Metal Mask PRÀº Àû¿ë Á¦¿Ü), Polymerization,
Etching °¡´É
- ±âŸ ½ÇÇè½Ç¿ë Àåºñ
2) Á¦Ç° Ư¡
- 2~8 inch wafer type applicable
- Plasma uniformity < ± 5%
- Manual or PLC-based automation or PC automation applicable
- °í°´ÀÇ Concept¿¡ ¸Â°Ô ¼³°è ¹× Á¦ÀÛ °¡´É
3) ÀÀ¿ëºÐ¾ß:
- Plasma Surface Treatment
- Semiconductor Process
- Plasma Polymerization
- Nano Application
- Solar Cell
- MEMS
- LED
- Bio

Ãë±ÞÇÏ´Â Item
1. »ê¼ÒºÐ¼®±â(³óµµ°è)
- Furnace, RTP, Reactive Sputter, µî¿¡ Àû¿ë
- Process ÁøÇà½Ã »ê¼Ò¿Í °ü·ÃµÈ Àåºñ¿¡ Àû¿ëµÇ¸ç ¹ÝµµÃ¼ »Ó¸¸ ¾Æ´Ï¶ó
»ê¾÷¿ëÀ¸·Îµµ »ç¿ë
2. RF(13.56MHz)¸¦ Àû¿ëÇÏ´Â ´ë±â¾Ð(»ó¾Ð) Plasma System:
- 2 Â÷¿ø(Æò¸é) Ç¥¸é ó¸® Àåºñ: Ä£¼ö¼º, ¼Ò¼ö¼º, Cleaning: Sample Test °¡´É
- 2 Â÷¿ø(Æò¸é) Ç¥¸é ó¸® Àåºñ: ÃʼҼö¼º
- ³ª³ë ºÐ¸» Ç¥¸é ó¸® Àåºñ (¼¼°è ÃÖÃÊ): 2010³â 1¿ù ºÎÅÍ Sample Test °¡´É

ȨÆäÀÌÁö´Â Á¦ÀÛ ÁßÀ¸·Î E-mail ¶Ç´Â ÀüÈ­¸¦ ÁÖ½Ã¸é »ó´ãÇØ µå¸®°Ú½À´Ï´Ù.

All For System
ÆÀÀå ¼Û¿õ¼·
ÁÖ¼Ò: ´ëÀü±¤¿ª½Ã À¯¼º±¸ ž¸³µ¿ 852-1
Tel : 042-933-2514
Fax: 042-933-9038
E-mail : ALLFORSYSTEM@gmail.com